Low cost electrostatic discharge-proof pumps manufactured from conductive loaded resin-based materials

ABSTRACT

Electrostatic discharge-proof pumps are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

RELATED PATENT APPLICATIONS

This Patent Application is related to U.S. Patent ApplicationINT04-032A, Ser. No. ______, and filed on ______, which is hereinincorporated by reference in its entirety.

This Patent Application claims priority to the U.S. Provisional PatentApplication 60/590,407, filed on Jul. 22, 2004, which is hereinincorporated by reference in its entirety.

This Patent Application is a Continuation-in-Part of INT01-002CIPC,filed as U.S. patent application Ser. No. 10/877,092, filed on Jun. 25,2004, which is a Continuation of INT01-002CIP, filed as U.S. patentapplication Ser. No. 10/309,429, filed on Dec. 4, 2002, now issued asU.S. Pat. No. 6,870,516, also incorporated by reference in its entirety,which is a Continuation-in-Part application of docket number INT01-002,filed as U.S. patent application Ser. No. 10/075,778, filed on Feb. 14,2002, now issued as U.S. Pat. No. 6,741,221, which claimed priority toU.S. Provisional Patent Application Ser. No. 60/317,808, filed on Sep.7, 2001, Ser. No. 60/269,414, filed on Feb. 16, 2001, and Ser. No.60/268,822, filed on Feb. 15, 2001, all of which are incorporated byreference in their entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to electrostatic discharge-proof pumps and, moreparticularly, to electrostatic discharge-proof pumps molded ofconductive loaded resin-based materials comprising micron conductivepowders, micron conductive fibers, or a combination thereof,substantially homogenized within a base resin when molded. Thismanufacturing process yields a conductive part or material usable withinthe EMF, thermal, acoustic, or electronic spectrum(s).

2. Description of the Prior Art

The transport of flammable liquids requires a pumping system that willignite the material. For example, petroleum is pumped at severaldifferent stages of the oil production process. It is pumped from underthe ground; it is pumped during the refinement process; it is pumpedonto and off from ships and/or trucks used for transport, and it ispumped through pipelines. Fuel such as automotive gasoline is anotherexample of a flammable liquid which is routinely pumped. Such fuel ispumped at the refinery; it is pumped onto and off from trucks used fortransport, and it is pumped into the end-use vehicle at the gas station.Aviation fuel and kerosene are pumped in a manner similar to gasoline.Hydraulic fluid is another flammable liquid which is routinely pumped.Hydraulic fluid is used for earth moving equipment and in manyindustrial machinery/equipment applications. In addition to liquids,flammable gas-phase fluids require pumping systems that will not ignitethe fluid. These gas-phase fluids include oxygen and hydrogen. Oxygenmay also be pumped as a liquid. In any situation where flammable fluidsare pumped, it is vital that the pump itself not be a source of sparkand potential combustion. In particular, the pump must be designed todissipate any static charges to thereby avoid an electrostatic discharge(ESD) event that may ignite the flammable fluid. A primary object of thepresent invention is to provide for reliable pump for flammable fluidshaving a reduced risk of ignition due to electrostatic discharge.

Several prior art inventions relate to pumps and electrostaticdischarge. U.S. Patent Publication US 2002/0006335 Al to Rohner teachesa method for measuring the operating parameters of a diaphragm pump byscreen printing a conductive plastic loop on the diaphragm andconnecting the loop to at least one bridge arm of a Wheatston bridge. Atime-dependent quantity is obtained from measuring voltage in thediagonal arm of the Wheatston bridge and used for determining thecondition of the diaphragm and its subsequent changing. U.S. patentPublication US 2003/0031560 A1 to Blattmann teaches a centrifugal slurrypump. U.S. Patent Publication 2004/0071574 Al to Bez et al teaches apiston machine for delivering gases that utilizes a diaphragm formed ofa plastic material interspersed with magnetic particles, and magneticmeans.

SUMMARY OF THE INVENTION

A principal object of the present invention is to provide an effectiveelectrostatic discharge-proof pump.

A further object of the present invention is to provide a method to forman electrostatic discharge-proof pump.

A further object of the present invention is to provide an electrostaticdischarge-proof pump molded of conductive loaded resin-based materials.

A further object of the present invention is to provide an electrostaticdischarge-proof pump that is intrinsically or inherently safe withrespect to static discharge.

A further object of the present invention is to provide an electrostaticdischarge-proof pump with reduced weight.

A further object of the present invention is to provide an electrostaticdischarge-proof pump with reduced manufacturing cost.

A further object of the present invention is to provide an electrostaticdischarge-proof pump with excellent corrosion resistance and chemicalimpermeability.

A further object of the present invention is to provide an electrostaticdischarge-proof pump with excellent thermal conductivity.

A further object of the present invention is to provide an electrostaticdischarge-proof pump with excellent acoustical response and noisedampening.

A further object of the present invention is to provide an electrostaticdischarge-proof pump where the electrostatic dissipation effect isoptimized based on the conductive loading.

A further object of the present invention is to provide components foran electrostatic discharge-proof pump.

A yet further object of the present invention is to provide an molded ofconductive loaded resin-based material where the chemical, electrical,thermal, or acoustical characteristics can be altered or the visualcharacteristics can be altered by forming a metal layer over theconductive loaded resin-based material.

In accordance with the objects of this invention, an electrostaticdischarge-proof pump device is achieved. The device comprises a housing.An inlet port is through the housing. An outlet port is through thehousing. An impeller is in the housing and between the inlet and outletports. The impeller comprises a conductive loaded, resin-based materialcomprising conductive materials in a base resin host.

Also in accordance with the objects of this invention, an electrostaticdischarge-proof pump device is achieved. The device comprises a housingcomprising a conductive loaded, resin-based material comprisingconductive materials in a base resin host. The percent by weight of theconductive materials is between about 20% and about 50% of the totalweight of the conductive loaded resin-based material. An inlet port isthrough the housing. An outlet port is through the housing. An impelleris in the housing and between the inlet and outlet ports. The impellercomprises the conductive loaded, resin-based material.

Also in accordance with the objects of this invention, an electrostaticdischarge-proof pump device is achieved. The device comprises a housingcomprising a conductive loaded, resin-based material comprising aconductive loaded, resin-based material comprising micron conductivefiber in a base resin host. The percent by weight of the micronconductive fiber is between about 20% and about 50% of the total weightof the conductive loaded resin-based material. An inlet port is throughthe housing. An outlet port is through the housing. An impeller is inthe housing and between the inlet and outlet ports. The impellercomprises the conductive loaded, resin-based material.

Also in accordance with the objects of this invention, a method to forman electrostatic discharge-proof pump component device is achieved. Themethod comprises providing a conductive loaded, resin-based materialcomprising conductive materials in a resin-based host. The conductiveloaded, resin-based material is molded into an electrostaticdischarge-proof pump component device.

Also in accordance with the objects of this invention, a method to forman electrostatic discharge-proof pump device is achieved. The methodcomprises providing a conductive loaded, resin-based material comprisingconductive materials in a resin-based host. The conductive loaded,resin-based material is molded into an electric motor device comprisinga housing, an inlet port through the housing, an outlet port through thehousing, and an impeller in the housing and between the inlet and outletports. The impeller comprises the conductive loaded, resin-basedmaterial.

Also in accordance with the objects of this invention, a method to forman electrostatic discharge-proof pump device is achieved. The methodcomprises providing a conductive loaded, resin-based material comprisingmicron conductive fiber in a resin-based host. The percent by weight ofthe micron conductive fiber is between 20% and 50% of the total weightof the conductive loaded resin-based material. The conductive loaded,resin-based material is molded into an electric motor device comprisinga housing comprising the conductive loaded, resin-based material, aninlet port through the housing, an outlet port through the housing, andan impeller in the housing and between the inlet and outlet ports. Theimpeller comprises the conductive loaded, resin-based material.

BRIEF DESCRIPTION OF THE DRAWINGS

In the accompanying drawings forming a material part of thisdescription, there is shown:

FIG. 1 illustrates a first preferred embodiment of the present inventionshowing an electrostatic discharge-proof pump formed of conductiveloaded resin-based material and, more particularly, illustrates a pumpused for drilling applications.

FIG. 2 illustrates a first preferred embodiment of a conductive loadedresin-based material wherein the conductive materials comprise a powder.

FIG. 3 illustrates a second preferred embodiment of a conductive loadedresin-based material wherein the conductive materials comprise micronconductive fibers.

FIG. 4 illustrates a third preferred embodiment of a conductive loadedresin-based material wherein the conductive materials comprise bothconductive powder and micron conductive fibers.

FIGS. 5 a and 5 b illustrate a fourth preferred embodiment whereinconductive fabric-like materials are formed from the conductive loadedresin-based material.

FIGS. 6 a and 6 b illustrate, in simplified schematic form, an injectionmolding apparatus and an extrusion molding apparatus that may be used tomold a electrostatic discharge-proof pump or pump component of aconductive loaded resin-based material.

FIG. 7 illustrates a second preferred embodiment of the presentinvention showing an electrostatic discharge-proof pump formed ofconductive loaded resin-based material and, more particularly,illustrates a centrifugal pump utilizing a balanced impeller.

FIG. 8 illustrates a third preferred embodiment of the present inventionshowing an electrostatic discharge-proof pump formed of conductiveloaded resin-based material and, more particularly, illustrates acentrifugal pump utilizing a balanced impeller.

FIG. 9 illustrates a fourth preferred embodiment of the presentinvention showing an electrostatic discharge-proof pump formed ofconductive loaded resin-based material and, more particularly,illustrates a pump which utilizes an impeller.

FIG. 10 illustrates a fifth preferred embodiment of the presentinvention showing an electrostatic discharge-proof pump formed ofconductive loaded resin-based material and, more particularly,illustrates a pump which utilizes a vane.

FIG. 11 illustrates a sixth preferred embodiment of the presentinvention showing an electrostatic discharge-proof pump formed ofconductive loaded resin-based material and, more particularly,illustrates a pump in a vehicle fuel dispensing application.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

This invention relates to v molded of conductive loaded resin-basedmaterials comprising micron conductive powders, micron conductivefibers, or a combination thereof, substantially homogenized within abase resin when molded.

The conductive loaded resin-based materials of the invention are baseresins loaded with conductive materials, which then makes any base resina conductor rather than an insulator. The resins provide the structuralintegrity to the molded part. The micron conductive fibers, micronconductive powders, or a combination thereof, are substantiallyhomogenized within the resin during the molding process, providing theelectrical, thermal, and/or acoustical continuity.

The conductive loaded resin-based materials can be molded, extruded orthe like to provide almost any desired shape or size. The moldedconductive loaded resin-based materials can also be cut, stamped, orvacuumed formed from an injection molded or extruded sheet or bar stock,over-molded, laminated, milled or the like to provide the desired shapeand size. The thermal or electrical conductivity characteristics ofelectrostatic discharge-proof pumps fabricated using conductive loadedresin-based materials depend on the composition of the conductive loadedresin-based materials, of which the loading or doping parameters can beadjusted, to aid in achieving the desired structural, electrical orother physical characteristics of the material. The selected materialsused to fabricate the pump devices are substantially homogenizedtogether using molding techniques and or methods such as injectionmolding, over-molding, insert molding, thermo-set, protrusion,extrusion, calendaring, or the like. Characteristics related to 2D, 3D,4D, and 5D designs, molding and electrical characteristics, include thephysical and electrical advantages that can be achieved during themolding process of the actual parts and the polymer physics associatedwithin the conductive networks within the molded part(s) or formedmaterial(s).

In the conductive loaded resin-based material, electrons travel frompoint to point when under stress, following the path of leastresistance. Most resin-based materials are insulators and represent ahigh resistance to electron passage. The doping of the conductiveloading into the resin-based material alters the inherent resistance ofthe polymers. At a threshold concentration of conductive loading, theresistance through the combined mass is lowered enough to allow electronmovement. Speed of electron movement depends on conductive loadingconcentration, that is, the separation between the conductive loadingparticles. Increasing conductive loading content reduces interparticleseparation distance, and, at a critical distance known as thepercolation point, resistance decreases dramatically and electrons moverapidly.

Resistivity is a material property that depends on the atomic bondingand on the microstructure of the material. The atomic microstructurematerial properties within the conductive loaded resin-based materialare altered when molded into a structure. A substantially homogenizedconductive microstructure of delocalized valance electrons is created.This microstructure provides sufficient charge carriers within themolded matrix structure. As a result, a low density, low resistivity,lightweight, durable, resin based polymer microstructure material isachieved. This material exhibits conductivity comparable to that ofhighly conductive metals such as silver, copper or aluminum, whilemaintaining the superior structural characteristics found in manyplastics and rubbers or other structural resin based materials.

The use of conductive loaded resin-based materials in the fabrication ofelectrostatic discharge-proof pumps significantly lowers the cost ofmaterials and the design and manufacturing processes used to hold easeof close tolerances, by forming these materials into desired shapes andsizes. The pumps can be manufactured into infinite shapes and sizesusing conventional forming methods such as injection molding,over-molding, or extrusion, calendaring, or the like. The conductiveloaded resin-based materials, when molded, typically but not exclusivelyproduce a desirable usable range of resistivity from between about 5 and25 ohms per square, but other resistivities can be achieved by varyingthe doping parameters and/or resin selection(s).

The conductive loaded resin-based materials comprise micron conductivepowders, micron conductive fibers, or any combination thereof, which aresubstantially homogenized together within the base resin, during themolding process, yielding an easy to produce low cost, electricallyconductive, close tolerance manufactured part or circuit. The resultingmolded article comprises a three dimensional, continuous network ofconductive loading and polymer matrix. Exemplary micron conductivepowders include carbons, graphites, amines or the like, and/or of metalpowders such as nickel, copper, silver, aluminum, or plated or the like.The use of carbons or other forms of powders such as graphite(s) etc.can create additional low level electron exchange and, when used incombination with micron conductive fibers, creates a micron fillerelement within the micron conductive network of fiber(s) producingfurther electrical conductivity as well as acting as a lubricant for themolding equipment. Carbon nano-tubes may be added to the conductiveloaded resin-based material. The addition of conductive powder to themicron conductive fiber loading may increase the surface conductivity ofthe molded part, particularly in areas where a skinning effect occursduring molding.

The micron conductive fibers may be metal fiber or metal plated fiber.Further, the metal plated fiber may be formed by plating metal onto ametal fiber or by plating metal onto a non-metal fiber. Exemplary metalfibers include, but are not limited to, stainless steel fiber, copperfiber, nickel fiber, silver fiber, aluminum fiber, or the like, orcombinations thereof. Exemplary metal plating materials include, but arenot limited to, copper, nickel, cobalt, silver, gold, palladium,platinum, ruthenium, and rhodium, and alloys of thereof. Any platablefiber may be used as the core for a non-metal fiber. Exemplary non-metalfibers include, but are not limited to, carbon, graphite, polyester,basalt, man-made and naturally-occurring materials, and the like. Inaddition, superconductor metals, such as titanium, nickel, niobium, andzirconium, and alloys of titanium, nickel, niobium, and zirconium mayalso be used as micron conductive fibers and/or as metal plating ontofibers in the present invention.

The structural material may be any polymer resin or combination ofpolymer resins. Non-conductive resins or inherently conductive resinsmay be used as the structural material. Conjugated polymer resins,complex polymer resins, and/or inherently conductive resins may be usedas the structural material. The dielectric properties of the resin-basedmaterial will have a direct effect upon the final electrical performanceof the conductive loaded resin-based material. Many different dielectricproperties are possible depending on the chemical makeup and/orarrangement, such as linking, cross-linking or the like, of the polymer,co-polymer, monomer, ter-polymer, or homo-polymer material. Structuralmaterial can be, here given as examples and not as an exhaustive list,polymer resins produced by GE PLASTICS, Pittsfield, Mass., a range ofother plastics produced by GE PLASTICS, Pittsfield, Mass., a range ofother plastics produced by other manufacturers, silicones produced by GESILICONES, Waterford, N.Y., or other flexible resin-based rubbercompounds produced by other manufacturers.

The resin-based structural material loaded with micron conductivepowders, micron conductive fibers, or in combination thereof can bemolded, using conventional molding methods such as injection molding orover-molding, or extrusion, or compression molding, or calendaring, tocreate desired shapes and sizes. The molded conductive loadedresin-based materials can also be stamped, cut or milled as desired toform create the desired shape form factor(s) of the electrostaticdischarge-proof pumps. The doping composition and directionalityassociated with the micron conductors within the loaded base resins canaffect the electrical and structural characteristics of the pumps andcan be precisely controlled by mold designs, gating and or protrusiondesign(s) and or during the molding process itself. In addition, theresin base can be selected to obtain the desired thermal characteristicssuch as very high melting point or specific thermal conductivity.

A resin-based sandwich laminate could also be fabricated with random orcontinuous webbed micron stainless steel fibers or other conductivefibers, forming a cloth like material. The webbed conductive fiber canbe laminated or the like to materials such as Teflon, Polyesters, or anyresin-based flexible or solid material(s), which when discretelydesigned in fiber content(s), orientation(s) and shape(s), will producea very highly conductive flexible cloth-like material. Such a cloth-likematerial could also be used in forming pumps that incorporate otherresin materials such as rubber(s) or plastic(s). When using conductivefibers as a webbed conductor as part of a laminate or cloth-likematerial, the fibers may have diameters of between about 3 and 12microns, typically between about 8 and 12 microns or in the range ofabout 10 microns, with length(s) that can be seamless or overlapping.

The conductive loaded resin-based material may also be formed into aprepreg laminate. A laminate, cloth, or webbing of the conductive loadedresin-based material is first impregnated with a resin-based material.In various embodiments, the conductive loaded resin-based material isdipped, coated, sprayed, and/or extruded with resin-based material tocause the laminate, cloth, or webbing to adhere together in a prepreggrouping that is easy to handle. This prepreg is then placed, or laidup, onto a form and heated to form a permanent bond. In anotherembodiment, the prepreg laid up onto the impregnating resin while theresin is still wet and then cured by heating or other means. In yetanother embodiment, a wet prepreg is formed by spraying, dipping, orcoating the conductive loaded resin-based material laminate, cloth, orwebbing in high temperature capable paint.

The conductive loaded resin-based material of the present invention canbe made resistant to corrosion and/or metal electrolysis by selectingmicron conductive fiber and/or micron conductive powder and base resinthat are resistant to corrosion and/or metal electrolysis. For example,if a corrosion/electrolysis resistant base resin is combined withstainless steel fiber and carbon fiber/powder, then a corrosion and/ormetal electrolysis resistant conductive loaded resin-based material isachieved. Another additional and important feature of the presentinvention is that the conductive loaded resin-based material of thepresent invention may be made flame retardant. Selection of aflame-retardant (FR) base resin material allows the resulting product toexhibit flame retardant capability. This is especially important inelectrostatic discharge-proof pumps as described herein.

The substantially homogeneous mixing of micron conductive fiber and/ormicron conductive powder and base resin described in the presentinvention may also be described as doping. That is, the substantiallyhomogeneous mixing converts the typically non-conductive base resinmaterial into a conductive material. This process is analogous to thedoping process whereby a semiconductor material, such as silicon, can beconverted into a conductive material through the introduction ofdonor/acceptor ions as is well known in the art of semiconductordevices. Therefore, the present invention uses the term doping to meanconverting a typically non-conductive base resin material into aconductive material through the substantially homogeneous mixing ofmicron conductive fiber and/or micron conductive powder into a baseresin.

As an additional and important feature of the present invention, themolded conductor loaded resin-based material exhibits excellent thermaldissipation characteristics. Therefore, electrostatic discharge-proofpumps manufactured from the molded conductor loaded resin-based materialcan provide added thermal dissipation capabilities to the application.For example, heat can be dissipated from electrical devices physicallyand/or electrically connected to pumps of the present invention.

As a significant advantage of the present invention, electrostaticdischarge-proof pumps constructed of the conductive loaded resin-basedmaterial can be easily interfaced to an electrical circuit or grounded.In one embodiment, a wire can be attached to a conductive loadedresin-based electrostatic discharge-proof pumps via a screw that isfastened to the pump casing. For example, a simple sheet-metal type,self tapping screw, when fastened to the material, can achieve excellentelectrical connectivity via the conductive matrix of the conductiveloaded resin-based material. To facilitate this approach a boss may bemolded into the conductive loaded resin-based material to accommodatesuch a screw. Alternatively, if a solderable screw material, such ascopper, is used, then a wire can be soldered to the screw that isembedded into the conductive loaded resin-based material. In anotherembodiment, the conductive loaded resin-based material is partly orcompletely plated with a metal layer. The metal layer forms excellentelectrical conductivity with the conductive matrix. A connection of thismetal layer to another circuit or to ground is then made. For example,if the metal layer is solderable, then a soldered connection may be madebetween the pump and a grounding wire.

Where a metal layer is formed over the surface of the conductive loadedresin-based material, any of several techniques may be used to form thismetal layer. This metal layer may be used for visual enhancement of themolded conductive loaded resin-based material article or to otherwisealter performance properties. Well-known techniques, such as electrolessmetal plating, electro metal plating, sputtering, metal vapordeposition, metallic painting, or the like, may be applied to theformation of this metal layer. If metal plating is used, then theresin-based structural material of the conductive loaded, resin-basedmaterial is one that can be metal plated. There are many of the polymerresins that can be plated with metal layers. For example, GE Plastics,SUPEC, VALOX, ULTEM, CYCOLAC, UGIKRAL, STYRON, CYCOLOY are a fewresin-based materials that can be metal plated. Electroless plating istypically a multiple-stage chemical process where, for example, a thincopper layer is first deposited to form a conductive layer. Thisconductive layer is then used as an electrode for the subsequent platingof a thicker metal layer.

A typical metal deposition process for forming a metal layer onto theconductive loaded resin-based material is vacuum metallization. Vacuummetallization is the process where a metal layer, such as aluminum, isdeposited on the conductive loaded resin-based material inside a vacuumchamber. In a metallic painting process, metal particles, such assilver, copper, or nickel, or the like, are dispersed in an acrylic,vinyl, epoxy, or urethane binder. Most resin-based materials accept andhold paint well, and automatic spraying systems apply coating withconsistency. In addition, the excellent conductivity of the conductiveloaded resin-based material of the present invention facilitates the useof extremely efficient, electrostatic painting techniques.

The conductive loaded resin-based material can be contacted in any ofseveral ways. In one embodiment, a pin is embedded into the conductiveloaded resin-based material by insert molding, ultrasonic welding,pressing, or other means. A connection with a metal wire can easily bemade to this pin and results in excellent contact to the conductiveloaded resin-based material. In another embodiment, a hole is formed into the conductive loaded resin-based material either during the moldingprocess or by a subsequent process step such as drilling, punching, orthe like. A pin is then placed into the hole and is then ultrasonicallywelded to form a permanent mechanical and electrical contact. In yetanother embodiment, a pin or a wire is soldered to the conductive loadedresin-based material. In this case, a hole is formed in the conductiveloaded resin-based material either during the molding operation or bydrilling, stamping, punching, or the like. A solderable layer is thenformed in the hole. The solderable layer is preferably formed by metalplating. A conductor is placed into the hole and then mechanically andelectrically bonded by point, wave, or reflow soldering.

Another method to provide connectivity to the conductive loadedresin-based material is through the application of a solderable ink filmto the surface. One exemplary solderable ink is a combination of copperand solder particles in an epoxy resin binder. The resulting mixture isan active, screen-printable and dispensable material. During curing, thesolder reflows to coat and to connect the copper particles and tothereby form a cured surface that is directly solderable without theneed for additional plating or other processing steps. Any solderablematerial may then be mechanically and/or electrically attached, viasoldering, to the conductive loaded resin-based material at the locationof the applied solderable ink. Many other types of solderable inks canbe used to provide this solderable surface onto the conductive loadedresin-based material of the present invention. Another exemplaryembodiment of a solderable ink is a mixture of one or more metal powdersystems with a reactive organic medium. This type of ink material isconverted to solderable pure metal during a low temperature cure withoutany organic binders or alloying elements.

A ferromagnetic conductive loaded resin-based material may be formed ofthe present invention to create a magnetic or magnetizable form of thematerial. Ferromagnetic micron conductive fibers and/or ferromagneticconductive powders are mixed with the base resin. Ferrite materialsand/or rare earth magnetic materials are added as a conductive loadingto the base resin. With the substantially homogeneous mixing of theferromagnetic micron conductive fibers and/or micron conductive powders,the ferromagnetic conductive loaded resin-based material is able toproduce an excellent low cost, low weight magnetize-able item. Themagnets and magnetic devices of the present invention can be magnetizedduring or after the molding process. The magnetic strength of themagnets and magnetic devices can be varied by adjusting the amount offerromagnetic micron conductive fibers and/or ferromagnetic micronconductive powders that are incorporated with the base resin. Byincreasing the amount of the ferromagnetic doping, the strength of themagnet or magnetic devices is increased. The substantially homogenousmixing of the conductive fiber network allows for a substantial amountof fiber to be added to the base resin without causing the structuralintegrity of the item to decline. The ferromagnetic conductive loadedresin-based magnets display the excellent physical properties of thebase resin, including flexibility, moldability, strength, and resistanceto environmental corrosion, along with excellent magnetic ability. Inaddition, the unique ferromagnetic conductive loaded resin-basedmaterial facilitates formation of items that exhibit excellent thermaland electrical conductivity as well as magnetism.

A high aspect ratio magnet is easily achieved through the use offerromagnetic conductive micron fiber or through the combination offerromagnetic micron powder with conductive micron fiber. The use ofmicron conductive fiber allows for molding articles with a high aspectratio of conductive fiber to cross sectional area. If a ferromagneticmicron fiber is used, then this high aspect ratio translates into a highquality magnetic article. Alternatively, if a ferromagnetic micronpowder is combined with micron conductive fiber, then the magneticeffect of the powder is effectively spread throughout the molded articlevia the network of conductive fiber such that an effective high aspectratio molded magnetic article is achieved. The ferromagnetic conductiveloaded resin-based material may be magnetized, after molding, byexposing the molded article to a strong magnetic field. Alternatively, astrong magnetic field may be used to magnetize the ferromagneticconductive loaded resin-based material during the molding process.

The ferromagnetic conductive loading is in the form of fiber, powder, ora combination of fiber and powder. The micron conductive powder may bemetal fiber or metal plated fiber. If metal plated fiber is used, thenthe core fiber is a platable material and may be metal or non-metal.Exemplary ferromagnetic conductive fiber materials include ferrite, orceramic, materials as nickel zinc, manganese zinc, and combinations ofiron, boron, and strontium, and the like. In addition, rare earthelements, such as neodymium and samarium, typified byneodymium-iron-boron, samarium-cobalt, and the like, are usefulferromagnetic conductive fiber materials. Exemplary ferromagnetic micronpowder leached onto the conductive fibers include ferrite, or ceramic,materials as nickel zinc, manganese zinc, and combinations of iron,boron, and strontium, and the like. In addition, rare earth elements,such as neodymium and samarium, typified by neodymium-iron-boron,samarium-cobalt, and the like, are useful ferromagnetic conductivepowder materials. A ferromagnetic conductive loading may be combinedwith a non-ferromagnetic conductive loading to form a conductive loadedresin-based material that combines excellent conductive qualities withmagnetic capabilities.

Electrostatic discharge-proof pumps comprising conductive loadedresin-based material of the present invention are ideally suited forcommercial and industrial applications wherein protection fromflammability is an issue. These applications include the pumping offlammable liquids and gasses. These applications further include thepumping of non-flammable liquids and gasses in an environment that ispotentially flammable. Because the conductive loaded resin-basedmaterial of the present invention is electrically conductive, it is ableto safely discharge any electric charge which may be present withoutcausing flammability or safety concerns. This trait is of criticalimportance in commercial and industrial pumping environments.

There are many examples of pumps which transport flammable liquid. Theseinclude the pumping of oil. Oil is pumped at several different stages ofthe oil production process. It is pumped from under the ground; it ispumped during the refinement process; it is pumped onto and off fromships and/or trucks used for transport, and it is pumped throughpipelines. Fuel such as automotive gasoline is another example of aflammable liquid which is routinely pumped. Such fuel is pumped at therefinery; it is pumped onto and off from trucks used for transport, andit is pumped into the end-use vehicle at the gas station. Aviation fueland kerosene are pumped in a manner similar to gasoline. Hydraulic fluidis another flammable liquid which is routinely pumped. Hydraulic fluidis used for earth moving equipment and in many industrialmachinery/equipment applications. Flammable gas-phase fluids alsorequire the use of electrostatic discharge-proof pumps. These gas-phasefluids include oxygen and hydrogen. Oxygen may also be pumped as aliquid. In any situation where flammable fluids are pumped, it is vitalthat the pump itself not be a source of spark and potential combustion.Conductive loaded resin-based material pumps of the present inventionprovide reliable transport of flammable fluids without the risk ofspark. They are inherently able to dissipate any potential electriccharge to ground.

There are also many applications for the use of a conductive loadedresin-based material electrostatic discharge-proof pump in the transportof non-flammable fluids or slurries in an environment that ispotentially flammable. The term “slurry” is used to describe thesuspension of a ground solid in a liquid. In industrial applicationssuch as mining, slurries are used to transport the ground solid. Aslurry pump is used to facilitate the transport of the slurry. That is,the slurry pump is used to pump the slurry from one location to another.Often the surrounding environment is potentially flammable. This is thecase in mines, for example. The conductive loaded resin-based materialpump of the present invention is ideal for this application in that itprovides intrinsic spark resistance. In slurry pump design, special caremust be taken to select wear-resistant materials. This is true becausethe solid pieces being transported generally cause more degradation thando typical liquid-only mediums. For the conductive loaded resin-basedmaterial slurry pump, the resin is selected from those very resistant towear. Further, the conductive loaded resin-based material slurry pump isoptionally coated with a material such as, for example, Teflon toinhibit wear. The conductive filler material of the conductive loadedresin-based material slurry pump is likewise selected from those able towithstand the abrasion imposed by the slurry. In every pump application,whether for flammable or non-flammable fluids or slurries, the resinhost and conductive material are selected from those resins which areresistant to the chemicals present in the particular environment.

Conductive loaded resin-based material of the present invention providesmany advantages when forming electrostatic discharge-proof pumps. Thefirst advantage is cost. The cost to fabricate conductive loadedresin-based material pumps is considerably less than the fabricationcost of the metal pumps found in the prior art. This is due to thesimplicity of the manufacturing process. Conductive loaded resin-basedmaterial pump components are formed using conventional moldingtechniques. This is a low cost alternative to typical metal fabrication.Reduced weight is another benefit of conductive loaded resin-basedmaterial pumps when compared to conventional metal pumps. The reducedweight of conductive loaded resin-based material of the presentinvention translates to reduced shipping costs both at the componentlevel and at the final pump product level. The reduced weight also makesthe conductive loaded resin-based material pump much more manageableduring installation at the job site. These benefits of cost and weightreduction apply to all conductive loaded resin-based materialelectrostatic discharge-proof pumps regardless of the application or thefluid being pumped.

Referring now to FIG. 1, a first preferred embodiment of the presentinvention is illustrated. A horizontal drilling-duty, electrostaticdischarge-proof pump 100 is shown. This exemplary pump 100 comprisesconductive loaded resin-based material in any or all of variouscomponents or features. In one embodiment, an external housing 114comprises a relatively thick wall of conductive loaded resin-basedmaterial. In another embodiment, access plates 116 comprise conductiveloaded resin-based material. In another embodiment, a shaft extension110 comprises conductive loaded resin-based material. In yet anotherembodiment, suction and/or discharge connection ports 112 are formed ofconductive loaded resin-based material. This pump 100 exemplifies anultra heavy duty pump used, for example, for pumping oil in drillingapplications. Pump components formed of the conductive loadedresin-based material provide reduced weight and manufacturing cost,excellent resistance to corrosion, chemical impermeability, andelectrostatic dissipation. Pumps or pump components comprising theconductive loaded resin-based material of the present inventiondemonstrate excellent electrical conductivity such that electrostaticcharge does not build. An intrinsically or inherently safe pump forflammable fluids is thus achieved. The conductive loading may beselected to achieve a range of resistivity values such that the materialdissipates electrostatic energy via resistive action or merely shuntsthe charge to ground. In addition, the pump or pump componentdemonstrates excellent thermal conductivity to dissipate frictional heatbuild-up. Finally, the pump or pump component exhibits excellentacoustical response to limit the noise produced by the pump.

Referring now to FIG. 7, a second preferred embodiment of the presentinvention is illustrated. An exemplary electrostatic discharge-proofpump 130 comprises conductive loaded resin-based material in any or allof various components or features. In particular, a centrifugal pump 130is shown. A suction inlet 136 provides the fluid entrance into the pump.The balanced impeller 134 serves to propel the fluid within the body ofthe pump 130. The open area of the pump housing is referred to as thevolute 138. Fluid journeys through the volute 138 on its way to beingexpelled through the discharge outlet 132. All of these componentscontact the fluid which is being pumped. In various embodiments any orall of these components 132, 134, 136, 138, and the housing whichadjoins/defines them comprise conductive loaded resin-based material. Inanother embodiment, a seal 140 comprises conductive loaded resin-basedmaterial. This seal 140 is fabricated using a base resin host whichremains pliable to provide an excellent seal to keep the pumped fluidfrom migrating beyond the seal 140. In another embodiment, the seal 140is a Ni-Resist or similar material as found in prior art. A shaft 146provides a means of inputting rotational energy into the pump system. Inanother embodiment, the shaft 146 comprises conductive loadedresin-based material. Alternately, the shaft 146 comprises metal or ametal alloy. Ball bearings 142 and/or other bearings, not shown, providea means of fixing the shaft 146 vertically and horizontally within thepump housing while enabling the shaft 146 to rotate freely on its axis.In one embodiment, the pedestal or stand 144 comprises conductive loadedresin-based material. Alternately, the stand 144 comprises metal or ametal alloy. In yet another embodiment, the stand 144 comprises metalmounting interfaces or “feet”, not shown, over-molded with conductiveloaded resin-based material. The stand 144 is integrally molded into thepump housing. Alternately, the stand 144 is a separate component whichmay be removed from the pump housing. Pump components formed of theconductive loaded resin-based material provide reduced weight andmanufacturing cost, excellent resistance to corrosion, chemicalimpermeability, and electrostatic dissipation.

Referring now to FIG. 8, a third preferred embodiment of the presentinvention is illustrated. Another electrostatic discharge-proof pump 150is shown. This pump 150 is similar to the pump 130 shown in FIG. 7 inthat both are designed to be self-priming, centrifugal pumps. In FIG. 8,the exterior of the volute 154 is labeled. In various embodiments, thesuction inlet 152, the volute 154, the balanced impeller 156, the seal158, and the bearings 160 are constructed of the conductive loadedresin-based material and function in much the same way as thosedescribed in FIG. 7.

Referring now to FIG. 9, a fourth preferred embodiment of the presentinvention is illustrated. Another electrostatic discharge-proof pump 170comprising conductive loaded resin-based material is shown. In oneembodiment, an impeller 172 comprises the conductive loaded resin-basedmaterial. A volute area 176 essentially adjoins the impeller 172. Inanother embodiment, a seal 176 comprises conductive loaded resin-basedmaterial. Alternately, the seal 176 comprises a Ni-resist material orother such material found in the art. In another embodiment, the pumphousing 178 comprises conductive loaded resin-based material. In anotherembodiment, a shaft 180 comprises conductive loaded resin-basedmaterial. In an alternate embodiment of the present invention, the shaft180 comprises metal or a metal alloy. The mounting stand 182 comprisesconductive loaded resin-based material. In an additional embodiment ofthe present invention, the mounting stand 182 comprises a metal mountingportion over-molded with conductive loaded resin-based material. In yetanother embodiment of the present invention, the mounting stand 182comprises metal. Pump components formed of the conductive loadedresin-based material provide reduced weight and manufacturing cost,excellent resistance to corrosion, chemical impermeability, andelectrostatic dissipation. Pumps or pump components comprising theconductive loaded resin-based material of the present inventiondemonstrate excellent electrical conductivity such that electrostaticcharge does not build. The conductive loading may be selected to achievea range of resistivity values such that the material dissipateselectrostatic energy via resistive action or merely shunts the charge toground. In addition, the pump or pump component demonstrates excellentthermal conductivity to dissipate frictional heat build-up. Finally, thepump or pump component exhibits excellent acoustical response to limitthe noise produced by the pump.

Referring now to FIG. 10, a fifth preferred embodiment of the presentinvention is illustrated. An electrostatic discharge-proof pump 190 forpetroleum application is shown. The pump 190 comprises conductive loadedresin-based material. This pump 190 represents petroleum pumps used topump fuel oil onto and off from delivery trucks. It is also used forstationary applications such as the pumping of refined petroleumproducts and industrial solvents. This particular pump 190 is a vanetype pump in that it utilizes vanes and a vane driver 192 rather than animpeller to propel the fluid. In one embodiment, the vanes and vanedriver 192 comprise conductive loaded resin-based material of thepresent invention. In another embodiment, mechanical seals 194 compriseconductive loaded resin-based material. In an alternate embodiment, themechanical seals 194 are formed of conventional materials. In anotherembodiment, the fluid inlet 196 comprises conductive loaded resin-basedmaterial. In another embodiment, the pump housing 198 comprisesconductive loaded resin-based material. Pump components formed of theconductive loaded resin-based material provide reduced weight andmanufacturing cost, excellent resistance to corrosion, chemicalimpermeability, and electrostatic dissipation.

Referring now to FIG. 11, a sixth preferred embodiment of the presentinvention is illustrated. A vehicle-fueling pump application 200 isshown. More specifically, a pump 210 is shown pumping gas from thestorage tank 250 through the pipe 220 to the fuel hose dispenser 230.Fuel is then pumped into the vehicles 240 on demand. In variousembodiments, the pump 210, tank 250, pipe, and/or dispenser 230 compriseconductive loaded resin-based material of the present invention. Pumpcomponents formed of the conductive loaded resin-based material providereduced weight and manufacturing cost, excellent resistance tocorrosion, chemical impermeability, and electrostatic dissipation. Pumpsor pump components comprising the conductive loaded resin-based materialof the present invention demonstrate excellent electrical conductivitysuch that electrostatic charge does not build. The conductive loadingmay be selected to achieve a range of resistivity values such that thematerial dissipates electrostatic energy via resistive action or merelyshunts the charge to ground. In addition, the pump or pump componentdemonstrates excellent thermal conductivity to dissipate frictional heatbuild-up. Finally, the pump or pump component exhibits excellentacoustical response to limit the noise produced by the pump.

FIGS. 1 and 7-11 illustrate various electrostatic discharge-proof pumpscomprising conductive loaded resin-based material. These exemplary pumpsrepresent only a few of the many forms which electrostaticdischarge-proof pumps comprising conductive loaded resin-based materialof the present invention may take. In the heretofore described pumps,any or all of the components comprising the pump comprise conductiveloaded resin-based material of the present invention. These pumpcomponents include, but are not limited to: the pump housing, mountingstand, impeller, vanes, vane driver, seals, O-rings, inlet, outlet,volute, valves, bearings, shaft, and the like. By careful selection ofthe base resin host and the conductive loading materials, conductiveloaded resin-based material provides the necessary structural, chemical,electrical, and thermal properties for various pump components invarious pump applications. Conductive loaded resin-based materialprovides significant advantages over conventional metal componentsespecially in terms of cost and weight.

The conductive loaded resin-based material of the present inventiontypically comprises a micron powder(s) of conductor particles and/or incombination of micron fiber(s) substantially homogenized within a baseresin host. FIG. 2 shows cross section view of an example of conductorloaded resin-based material 32 having powder of conductor particles 34in a base resin host 30. In this example the diameter D of the conductorparticles 34 in the powder is between about 3 and 12 microns.

FIG. 3 shows a cross section view of an example of conductor loadedresin-based material 36 having conductor fibers 38 in a base resin host30. The conductor fibers 38 have a diameter of between about 3 and 12microns, typically in the range of 10 microns or between about 8 and 12microns, and a length of between about 2 and 14 millimeters. The micronconductive fibers 38 may be metal fiber or metal plated fiber. Further,the metal plated fiber may be formed by plating metal onto a metal fiberor by plating metal onto a non-metal fiber. Exemplary metal fibersinclude, but are not limited to, stainless steel fiber, copper fiber,nickel fiber, silver fiber, aluminum fiber, or the like, or combinationsthereof. Exemplary metal plating materials include, but are not limitedto, copper, nickel, cobalt, silver, gold, palladium, platinum,ruthenium, and rhodium, and alloys of thereof. Any platable fiber may beused as the core for a non-metal fiber. Exemplary non-metal fibersinclude, but are not limited to, carbon, graphite, polyester, basalt,man-made and naturally-occurring materials, and the like. In addition,superconductor metals, such as titanium, nickel, niobium, and zirconium,and alloys of titanium, nickel, niobium, and zirconium may also be usedas micron conductive fibers and/or as metal plating onto fibers in thepresent invention.

These conductor particles and/or fibers are substantially homogenizedwithin a base resin. As previously mentioned, the conductive loadedresin-based materials have a sheet resistance between about 5 and 25ohms per square, though other values can be achieved by varying thedoping parameters and/or resin selection. To realize this sheetresistance the weight of the conductor material comprises between about20% and about 50% of the total weight of the conductive loadedresin-based material. More preferably, the weight of the conductivematerial comprises between about 20% and about 40% of the total weightof the conductive loaded resin-based material. More preferably yet, theweight of the conductive material comprises between about 25% and about35% of the total weight of the conductive loaded resin-based material.Still more preferably yet, the weight of the conductive materialcomprises about 30% of the total weight of the conductive loadedresin-based material. Stainless Steel Fiber of 6-12 micron in diameterand lengths of 4-6 mm and comprising, by weight, about 30% of the totalweight of the conductive loaded resin-based material will produce a veryhighly conductive parameter, efficient within any EMF, thermal,acoustic, or electronic spectrum. Referring now to FIG. 4, anotherpreferred embodiment of the present invention is illustrated where theconductive materials comprise a combination of both conductive powders34 and micron conductive fibers 38 substantially homogenized togetherwithin the resin base 30 during a molding process.

Referring now to FIGS. 5 a and 5 b, a preferred composition of theconductive loaded, resin-based material is illustrated. The conductiveloaded resin-based material can be formed into fibers or textiles thatare then woven or webbed into a conductive fabric. The conductive loadedresin-based material is formed in strands that can be woven as shown.FIG. 5 a shows a conductive fabric 42 where the fibers are woventogether in a two-dimensional weave 46 and 50 of fibers or textiles.FIG. 5 b shows a conductive fabric 42′ where the fibers are formed in awebbed arrangement. In the webbed arrangement, one or more continuousstrands of the conductive fiber are nested in a random fashion. Theresulting conductive fabrics or textiles 42, see FIG. 5 a, and 42′, seeFIG. 5 b, can be made very thin, thick, rigid, flexible or in solidform(s).

Similarly, a conductive, but cloth-like, material can be formed usingwoven or webbed micron stainless steel fibers, or other micronconductive fibers. These woven or webbed conductive cloths could also besandwich laminated to one or more layers of materials such asPolyester(s), Teflon(s), Kevlar(s) or any other desired resin-basedmaterial(s). This conductive fabric may then be cut into desired shapesand sizes.

Electrostatic discharge-proof pumps formed from conductive loadedresin-based materials can be formed or molded in a number of differentways including injection molding, extrusion, calendaring, or chemicallyinduced molding or forming. FIG. 6 a shows a simplified schematicdiagram of an injection mold showing a lower portion 54 and upperportion 58 of the mold 50. Conductive loaded blended resin-basedmaterial is injected into the mold cavity 64 through an injectionopening 60 and then the substantially homogenized conductive materialcures by thermal reaction. The upper portion 58 and lower portion 54 ofthe mold are then separated or parted and the pump component is removed.

FIG. 6 b shows a simplified schematic diagram of an extruder 70 forforming pump components using extrusion. Conductive loaded resin-basedmaterial(s) is placed in the hopper 80 of the extrusion unit 74. Apiston, screw, press or other means 78 is then used to force thethermally molten or a chemically induced curing conductive loadedresin-based material through an extrusion opening 82 which shapes thethermally molten curing or chemically induced cured conductive loadedresin-based material to the desired shape. The conductive loadedresin-based material is then fully cured by chemical reaction or thermalreaction to a hardened or pliable state and is ready for use.Thermoplastic or thermosetting resin-based materials and associatedprocesses may be used in molding the conductive loaded resin-basedarticles of the present invention.

The advantages of the present invention may now be summarized. Aneffective electrostatic discharge-proof pump is achieved. A method toform an electrostatic discharge-proof pump is achieved. Theelectrostatic discharge-proof pump is molded of conductive loadedresin-based materials. The electrostatic discharge-proof pump isintrinsically or inherently safe with respect to static discharge. Theelectrostatic discharge-proof pump has reduced weight and manufacturingcost. The electrostatic discharge-proof pump has excellent corrosionresistance and chemical impermeability. The electrostaticdischarge-proof pump has excellent thermal conductivity. Theelectrostatic discharge-proof pump has excellent acoustical response andnoise dampening. The electrostatic discharge-proof pump has optimalelectrostatic dissipation effect based on the conductive loading.Components for an electrostatic discharge-proof pump are achieved. Thechemical, electrical, thermal, or acoustical characteristics can bealtered or the visual characteristics can be altered by forming a metallayer over the conductive loaded resin-based material.

As shown in the preferred embodiments, the novel methods and devices ofthe present invention provide an effective and manufacturablealternative to the prior art.

While the invention has been particularly shown and described withreference to the preferred embodiments thereof, it will be understood bythose skilled in the art that various changes in form and details may bemade without departing from the spirit and scope of the invention.

1. A method to form an electrostatic discharge-proof pump componentdevice, said method comprising: providing a conductive loaded,resin-based material comprising conductive materials in a resin-basedhost; molding said conductive loaded, resin-based material into anelectrostatic discharge-proof pump component device.
 2. The methodaccording to claim 1 wherein the percent by weight of said conductivematerials is between about 20% and about 50% of the total weight of saidconductive loaded resin-based material.
 3. The method according to claim1 wherein said conductive materials comprise micron conductive fiber. 4.The method according to claim 2 wherein said conductive materialsfurther comprise conductive powder.
 5. The method according to claim 1wherein said conductive materials are metal.
 6. The method according toclaim 1 wherein said conductive materials are non-conductive materialswith metal plating.
 7. The method according to claim 1 wherein said stepof molding comprises: injecting said conductive loaded, resin-basedmaterial into a mold; curing said conductive loaded, resin-basedmaterial; and removing said electrostatic discharge-proof pump componentdevice from said mold.
 8. The method according to claim 1 wherein saidstep of molding comprises: loading said conductive loaded, resin-basedmaterial into a chamber; extruding said conductive loaded, resin-basedmaterial out of said chamber through a shaping outlet; and curing saidconductive loaded, resin-based material to form said electrostaticdischarge-proof pump component device.
 9. The method according to claim1 wherein said electrostatic discharge-proof pump component devicecomprises a housing.
 10. The method according to claim 1 wherein saidelectrostatic discharge-proof pump component device comprises animpeller.
 11. The method according to claim 1 wherein said electrostaticdischarge-proof pump component device comprises an inlet or outlet port.12. The method according to claim 1 wherein said electrostaticdischarge-proof pump component device comprises a valve.
 13. A method toform an electrostatic discharge-proof pump device, said methodcomprising: providing a conductive loaded, resin-based materialcomprising conductive materials in a resin-based host; and molding saidconductive loaded, resin-based material into an electric motor devicecomprising: a housing; an inlet port through said housing; an outletport through said housing; and an impeller in said housing and betweensaid inlet and outlet ports wherein said impeller comprises saidconductive loaded, resin-based material.
 14. The method according toclaim 13 wherein said conductive materials are nickel plated carbonmicron fiber, stainless steel micron fiber, copper micron fiber, silvermicron fiber or combinations thereof.
 15. The method according to claim13 wherein said conductive materials comprise micron conductive fiberand conductive powder.
 16. The method according to claim 15 wherein saidconductive powder is nickel, copper, or silver.
 17. The method accordingto claim 15 wherein said conductive powder is a non-metallic materialwith a metal plating.
 18. The method according to claim 13 wherein saidhousing comprises said conductive loaded resin-based material.
 19. Amethod to form an electrostatic discharge-proof pump, said methodcomprising: providing a conductive loaded, resin-based materialcomprising micron conductive fiber in a resin-based host wherein thepercent by weight of said micron conductive fiber is between 20% and 50%of the total weight of said conductive loaded resin-based material; andmolding said conductive loaded, resin-based material into an electricmotor device comprising: a housing comprising said conductive loaded,resin-based material; an inlet port through said housing; an outlet portthrough said housing; and an impeller in said housing and between saidinlet and outlet ports wherein said impeller comprises said conductiveloaded, resin-based material.
 20. The method according to claim 19wherein said micron conductive fiber is stainless steel.
 21. The methodaccording to claim 19 wherein said conductive loaded resin-basedmaterial further comprises conductive powder.
 22. The method accordingto claim 19 wherein said micron conductive fiber has a diameter ofbetween about 3 μm and about 12 μm and a length of between about 2 mmand about 14 mm.
 23. The method according to claim 19 wherein said inletport or said outlet port comprises said conductive loaded resin-basedmaterial.
 24. The method according to claim 19 further comprising a sealcomprising said conductive loaded resin-based material.
 25. The methodaccording to claim 19 further comprising a valve comprising saidconductive loaded resin-based material.